5G_Foil
Consortium:
Call: Eurostars 3 – Call 4
Eurostars is part of the European Partnership on Innovative SMEs. The partnership is co-funded by the European Union through Horizon Europe. The work in 5G_Foil project is co-funded by the Polish National Centre for Research and Development under contracts InnovativeSMEs/4/100/5G_Foil/2023 and InnovativeSMEs/4/90/5G_Foil/2023, and by the Luxembourg Ministry of Economy under contract 2023-A127-X187.
International Consortium:
Partners:
- Poland: EM Invent Sp. z o.o.
- Luxembourg: Circuit Foil Luxembourg sŕrl
Duration: 01.11.2024 – 30.10.2026
5G Foils Events:
June 15-20, 2024, San Francisco, CA, US
April 8-10, 2025, Vienna, Austria
January 29-30, 2025, Vienna, Austria
January 22-24, 2025, San Juan, Puerto Rico
January 19-22, 2025, San Juan, Puerto Rico
December 9-10, 2024, Belgrade, Serbia
November 19, 2024, Warsaw, Poland
- 1st Annual Meeting
June 16-21, 2024, Washington, DC, US
October 25-27, 2023, Taipei, Taiwan
5G Foils Articles, Presentations, Posters & Outreach:
- M.Celuch, „Modelling-based characterisation of copper foils for mmWave applications„, IMPACT 2023: Intl. Microsystems, Packaging, Assembly and Circuits Technology Conf., Taipei, Taiwan, 25-27 Oct. 2023.
- Malgorzata Celuch, Marzena Olszewska-Placha, Lukasz Nowicki, Pawel Kopyt, Jerzy Cuper, „Evaluation of Surface Roughness of Copper Foils for 5G Applications Using Novel mmWave Resonators„, Apex Expo IPC, Anaheim, USA, April 9, 2024. (paper under IPC Copyright, provided here with kind permission from the IPC).
- T. Nalecz, L. Nowicki, M. Celuch, M. Baranowski, A. Lamecki, M. Mrozowski, „An Open Platform Tool for 2D Multipactor Simulations in Metallic Microwave Components„, 25th International Microwave and Radar Conference MIKON, 1-3 July 2024, Wroclaw, Poland – poster.
- M. Celuch, T. Devahif, T. Nalecz, J. Rudnicki, „A Systematic Study of Correlation between Surface Roughness and Microwave Effective Conductivity of Copper Foils for Ultra-Low-Loss Applications„, 25th International Microwave and Radar Conference MIKON, 1-3 July 2024, Wroclaw, Poland – presentation.
- M. Olszewska-Placha, „2D Scanner for Surface-Wise Measurements of Complex Permittivity of Emerging LTCC and ULTCC Materials„, Microwave Application Seminars MicroApps TUMA2, 18 June 2024.
- M. Celuch, „Screening of the mmWave Signal Loss Properties of Copper Foils without the Need for Test Circuit Manufacturing„, Microwave Application Seminars MicroApps TUMA11, 18 June 2024.
- M. Celuch, „Accurate Materials Testing as an Enabler for Microwave and Millimeter-Wave Industries„, Industry Keynote, IEEE IMS2024, Washington DC, 20 June 2024. Th1E-1.
- M. Celuch, M. Olszewska-Placha, L. Nowicki and W. Gwarek, „A Novel Q-Choked Resonator for Microwave Material Measurements Alleviating Sample Thickness Limitations of Existing Techniques„, in IEEE Microwave and Wireless Technology Letters, vol. 34, no. 6, pp. 845-848, June 2024 – presentation.
- M. Celuch, T. Devahif, T. Nalecz, J. Rudnicki, „Modeling-Based Methodology for Electromagnetic Screening of Copper Foils for High-Frequency Applications„, IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO’2024), 12-14 August 2024, Montreal, Canada – presentation.
- T. Nalecz, M. Baranowski, M. Celuch, A. Lamecki, L. Nowicki, M. Mrozowski, „Multipactor Modeling in 2D for Open Insight into the EM Behavior of Metalic Microwave Components„, IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO’2024), 12-14 August 2024, Montreal, Canada – presentation.