18th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Taipei, Taiwan
October 25-27, 2023
MPACT 2023 was organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI, and TPCA, bringing together professionals in the field of PCB and packaging. The conference took place from October 25th to 27th at Taipei Nangang Exhibition Center alongside TPCA Show 2023, focusing on the theme „IMPACT on the future of HPC, AI, and Metaverse”. The symposium aimed to explore the latest electronic technologies and foster collaboration among enterprises and organizations.
During the event, Dr. Malgorzata Celuch presented recent advances in the iNEMI „Reliability & Loss Properties of Copper Foils for 5G Applications” project. The talk highlighted techniques for the electrical characterization of metallic foils developed by QWED in response to the project’s needs. Considerations of electrical performance and PCB durability at mm-waves often posed conflicting requirements for copper foil materials and pre-bond treatments.
- Date: October 25, 2023
- Time: 13:30 PM - 15:30 PM
- Venue: Nangang International Exhibition Center, Hall 1, Taipei, Taiwan
- Room: R504a
- Session: Industrial session - "iNEMI"
- Session Chair: Masahiro Tsuriya, iNEMI / Jeffrey Lee, IST
- Presentation file available here.
The organizers expressed anticipation for an insightful presentation by Dr. Malgorzata Celuch, shedding light on cutting-edge developments in copper foil characterization for mmWave applications. Attendees were encouraged to stay tuned for updates and further details from IMPACT 2023.