EMMC 2023 - 4th EMMC International Workshop - The European Materials Modelling Council

Vienna, Austria
April 26-28, 2023

We would like to express our gratitude to the organizers of the 4th EMMC International Workshop 2023 for hosting an exceptional conference. As one of the proud sponsors of this prestigious event, we were delighted to be part of such a significant gathering in the field. For more details about the conference, you can visit the official website here.

The workshop took place at the renowned TU Wien, situated in the vibrant city of Vienna, Austria. The TU Wien, known for its outstanding research and academic excellence, provided an ideal setting for this gathering. With its state-of-the-art facilities and a rich academic environment, participants were immersed in an inspiring atmosphere conducive to collaboration and knowledge exchange.

A standout moment from the workshop was a captivating talk entitled „From Computational Electromagnetics to Modelling-Based Characterization of Materials for Electronic and Energy Technologies.” This engaging presentation explored the intersection of computational electromagnetics and material characterization, providing valuable insights into the latest advancements and their implications for electronic and energy technologies.

During the workshop, our company proudly showcased its presence by hosting an exhibition stand. This exhibition served as a hub for industry leaders and participants to engage, fostering discussions around cutting-edge technologies and innovative solutions in the field of material modelling. We were thrilled to interact with fellow professionals, exchange ideas, and demonstrate our commitment to advancing the industry.

As part of our involvement in the conference, we had the opportunity to showcase our contributions to the I4BAGS and ULTCC6G_Epac projects. The I4BAGS project focuses on developing innovative packaging solutions for electronic devices, with an emphasis on sustainability and performance. To learn more about this project, we invite you to visit this subpage. Similarly, the ULTCC6G_Epac project explores the potential of ultra-low temperature co-fired ceramics (ULTCC) for high-frequency and high-power electronic packaging applications. This groundbreaking project aims to advance electronic materials and enable the realization of advanced technologies. You can find detailed information about the ULTCC6G_Epac project here.

The 4th EMMC International Workshop 2023 proved to be a resounding success, providing a platform for researchers, industry professionals, and experts to share their knowledge and insights. We extend our sincere appreciation to the organizers for their tremendous efforts in orchestrating such a remarkable event. Looking ahead, we eagerly anticipate future conferences that will further drive advancements in the field of material modelling.