ULTCC6G_EPac
Ultra-Low Temperature Co-fired Ceramics for 6th Generation Electronic Packaging
About
Call: M-ERA.NET 2 Call 2020
Financing Agency: National Centre for Research and Development
National Consortium:
Consortium Leader: Sieć Badawcza Łukasiewicz – Instytutem Mikroelektroniki i Fotoniki (Ł-IMiF)
Consortium: QWED Sp. z o.o.
International Consortium:
Consortium Leader: Fraunhofer Institute for Ceramic Technologies and Systems (IKTS) (DE)
Consortium: Lukasiewicz-Instytut Mikroelektroniki I Fotoniki (L-IMiF) (PL), QWED Sp. z o.o. (PL), Laboratoire d’électronique des technologies de l’information (CEA Leti) (FR), INOVEOS (FR)
Duration: 01.09.2021 – 31.08.2024
The main objective of the ULTCC6G_EPac is to develop novel functional materials based on advanced multilayer technology (ULTCC), characterise their properties (e.g. electrical) and to demonstrate and validate the telecommunication devices based on the ULTCC6G_EPac.
ULTCC6G_EPac Events:
August 11-14, 2024, Montreal, Canada
July 1-4, 2024, Wroclaw, Poland
June 16-21, 2024, Washington, USA
June 3-5, 2024, Namur, Belgium
June 4, 2024, Warsaw, Poland
April 9-11, 2024, Anaheim, USA
October 25-27, 2023, Taipei, Taiwan
September 25-28, 2023, Mainz, Germany
September 11-14, 2023, Cardiff, UK
June 28 – 30, 2023, Winnipeg, Canada
June 27-29, 2023, Denver, Colorado, USA
June 11-16, 2023, San Diego, California, USA
May 8-12, 2023, Noordwijk, Netherlands
April 26-28, 2023, Vienna, Austria
January 22-25, 2023, Las Vegas, Nevada, US
January 18-20, 2023, Orlando, FL, US
November 14-18, 2022, Online
September 26-29, 2022, Milan, Italy
September 12-15, 2022, Gdansk, Poland
June 19-24, 2022, Denver, Colorado, USA
June 14-16, 2022, Savannah, Georgia, USA
Articles, Presentations, Posters & Outreach:
- J.Koper, M. Celuch, M. Olszewska-Placha and P. Korpas, „A Comparative Study of Deblurring Methods for Dielectric Resonator Scans of Material Surfaces”, 2024 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO’2024), 12-14 August 2024, Montreal, Canada,
- M. Olszewska-Placha, J. Varghese, B. Synkiewicz-Musialska, Microwave and THz characterization of dielectric properties of bulk glass-ceramic composites and ULTCC substrates, IEEE Xplore Proc. 25th International Microwave and Radar Conference (MIKON), Wrocław, Poland, 01-04 July 2024, 327-329. DOI: 10.23919/MIKON60251.2024.10633917.
- J. Koper, M. Celuch, M. Olszewska-Placha, P. Korpas, „Evaluation of Image Restoration Technique for Dielectric Resonator Mapping of Materials„, IEEE Xplore Proc. 25th International Microwave and Radar Conference (MIKON), Wrocław, Poland, 01-04 July 2024, 228-231
- M. Celuch, M. Olszewska-Placha, L. Nowicki and W. Gwarek, „A Novel Q-Choked Resonator for Microwave Material Measurements Alleviating Sample Thickness Limitations of Existing Techniques”, in IEEE Microwave and Wireless Technology Letters, vol. 34, no. 6, pp. 845-848, June 2024, doi: 10.1109/LMWT.2024.3397912.
- M. Olszewska-Placha, J. Varghese, B. Synkiewicz-Musialska, „GHz and THz Characterization of Novel ULTCC Materials for Emerging Technologies”, Proceedings of 58th Annual Microwave Power Symposium (IMPI 58), Reston, USA, 29-31 May 2024, pp. 112-114
- Malgorzata Celuch, Marzena Olszewska–Placha, Lukasz Nowicki, Pawel Kopyt, Jerzy Cuper, „Evaluation of Surface Roughness of Copper Foils for 5G Applications Using Novel mmWave Resonators”, Apex Expo IPC, Anaheim, USA, April 9, 2024.
- Marzena Olszewska-Placha, Jobin Varghese, Dorota Szwagierczak, Manhica Birgit, Steffen Ziesche, Janusz Rudnicki, Beata Synkiewicz-Musialska, „Bulk glass-ceramic composites and ULTCC substrates for microwave and millimetre-wave applications„, Materials Research Bulletin, Volume 177, 2024, 112862, ISSN 0025-5408.
- „Microwave and THz Characterization of Dielectric Properties of New ULTCC Materials for 5G and 6G Systems”, Marzena Olszewska-Placha, Jobin Varghese, Dorota Szwagierczak, Janusz Rudnicki, Beata Synkiewicz-Musialska, Steffen Ziesche, 12th International Conference on Microwave Materials and their Applications, 28 September 2023
- Presentation: B. Salski, M. Olszewska–Placha and P. Czekala, „Microwave Characterization of Liquids with Resonant Methods„, 57th Annual Microwave Power Symposium (IMPI 57) of the International Microwave Power Institute, Denver, Colorado, USA, 27-29 June 2023.
- Presentation: „Modelling based large surface testing of LTCC and ULTCC substrates for antenna array design„, M. Olszewska–Placha, D. Szwagierczak, J. Varghese, J. Rudnicki, B. Synkiewicz Musialska, M. Ihle, S.Ziesche, IEEE MTT-S International Conference on NEMO, Canada, June 28, 2023.
- Say Phommakesone, Lucas Enright, Marzena Olszewska-Placha, Urmi Ray „mmWavePermittivity Standard Reference Material Development„, IMS Industry Workshop IWWE6 Wednesday, 14 June 2023.
- Presentation: „Advances in Computational Modeling and Materials Characterization for the Microwave Power Industry„, M. Celuch, M. Olszewska–Placha, WMG-4 Workshops on International Microwave Symposium 2023, 12 June 2023.
- Presentation: „Benchmarking of Current Industrial Best Practices and Emerging Techniques for the Consistent Electric and Dielectric Characterisation of Materials from Microwave to Millimetre Wave Ranges„, Malgorzata Celuch , Marzena Olszewska Placha, Lukasz Nowicki, Janusz Rudnicki, 1st Space Microwave Week 2023, 8-12 May 2023.
- Presentation: „From Computational Electromagnetics to Modelling Based Characterisation of Materials for Electronic and Energy Technologies„, M. Celuch, 4th EMMC International Workshop 2023, 26-28 April 2023.
- Poster: „Twinned Modelling – Characterisation (MODA-CHADA) Solutions for Electronic and Energy Materials: from H2020 MMAMA and NanoBat to M-ERA.NET ULTCC6G_Epac and I4BAGS Projects„, M. Celuch, M. Olszewska-Placha, J. Rudnicki and L. Nowicki, 4th EMMC International Workshop 2023, 26-28 April 2023.
- Presentation: „Modelling Based Characterisation of Materials from Micro to Millimetre Waves„, Malgorzata Celuch, IEEE Radio & Wireless Week, Women in Microwaves Event Las Vegas, Nevada, January 22, 2023.
- Presentation: „Evaluation and extensions of resonator techniques for the characterization of ceramics and energy materials relevant to 6G applications„, Marzena Olszewska–Placha, Malgorzata Celuch , Lukasz Nowicki, Janusz Rudnicki, Electronic Materials and Applications 2023, S21: Materials, Devices, and Applications in 6G Telecommunications, 19 January 2023.
- Presentation: „Microwave characterisation and modelling of materials in European initiative„, M. Celuch, 2nd IEEE Ukrainian Microwave Week UkrMW, November 14-18, 2022, Online.
- ULTCC6G_EPac information leaflet – presented at European Microwave Week, September 26-29 2022, Milan, Italy.
- M. Olszewska-Placha, D. Szwagierczak, B. Synkiewicz-Musialska, J. Rudnicki, J. Kulawik, „GHz Characterisation of dielectric properties of ultra-low temperature co-fired ceramic materials for 6G systems application„, 24th International Microwave and Radar Conference, 12-14 Septemeber 2022, Gdansk, Poland – poster.
- Marzena Olszewska-Placha, Dorota Szwagierczak, Beata Synkiewicz-Musialska, „Simulation-based resonant material measurement technique for precise characterization of LTCC and ULTCC materials towards 5G applications„, 2022 IEEE MTT-S International conference on Electromagnetic and Multiphysics Modelling and Optimization (NEMO 2022), July 6-8, 2022, Limoges, France, – abstract.
- Presentation: B.Salski and M. Olszewska-Placha, „FDTD modeling of microwave power applicators„, invited paper, 56th Annual Microwave Power Symposium (IMPI 56) of the International Microwave Power Institute, Savannah, GA, 14-16 June 2022.
- M. Celuch, M.J. Hill, T. Karpisz, M. Olszewska-Placha, S. Phommakesone, U. Ray, B. Salski, „Benchmarking of GHz resonator techniques for the characterisation of 5G/mmWave materials„, 51st European Microwave Conference, London 2-6 April 2022, pp. 568-571 (copyright European Microwave Association, EuMA).
- M. Olszewska-Placha, M. Celuch, „5G Electronics: Bridging the measurement challenges„, 18th International Conference on Device Packaging, March 7-10, 2022.
- Presentation: M. Celuch, M. Olszewska-Placha, J. Rudnicki, „Simulation-based resonant imaging of electronic materials for enhanced design in 5G and other emerging technologies„, Electronic Materials and Applications EMA 2022 virtual conference, 19-21 January 2022.
- Presentation: M. Olszewska-Placha, „Computer modelling – a virtual laboratory for emerging technologies” at virtual IEEE Day 2021, Poland, Oct. 2021.
Acknowledgement
ULTCC6G_EPac project is co-funded by the Polish National Centre for Research and Development under M-ERA.NET2/2020/1/2021 contract.
M-ERA.NET 2 has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 685451.